BGA Rework System, QUICK EA-H15
1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop control and the even heat distribution is realized.
2. The PL part of the infrared BGA rework station is designed with dichromatic vision alignment, which realizes the good coordination of the solder ball and the pad.
3. The machine is connected with PC via IRSoft to record and analyze the operating process, and form the curve.
|Bottom Preheating Power||1600W (400W×4, dark infrared heater)|
|2000W (500W×4, high infrared heating tube, optional)|
|Power of Top Heater||720W (120W×6, infrared heating tube, wave length: 2-8µm)|
|Range of Top Heating Area||20-60mm (X, Y adjustable)|
|Bottom Preheating Area||290×290mm|
|Max. PCB Size||400×400mm|
|Communication||USB (Connected with PC)|
|Temperature Sensor||Non-contact infrared sensor|
|Camera||22×10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format|
|BGA Size Range||2×2-60×60(mm)|
|Video Output Signal||Video signal|
|RPC||22×10 times magnifying|
|Horizontal resolution: 480 lines|
Note：monitor is not the standard configuration for this product. It is optional.